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Our Products #406218

Semiconductor

We offer a wide range of fabricated metal parts and components for application in the front-of-line and end-of-line semiconductor LED opto-electronics processes. LEAD FRAME CARRIER SLOT MAGAZINE Lead frame carrier or slot magazine can be customised for varied package sizes, capacity levels and pitching. We offer services as such :Open toolings for standard lead frame packagesDesign customisation for specific operating conditionsEngraving and barcoding servicesAPPLICATION : Lead frame handling media for semiconductor assembly FOL and EOL processesDie AttachMoldingPlatingTrim & FormWire BondPlasma CleanMarkingFINISHING :Anodise Electrolytic, refer to colour chartHard AnodiseElectroless Nickel Plating ( ENP )Other finishing available upon request
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MAGAZINE CARRIER

Magazine carrier transports lead frame magazines from one station to another throughout the semiconductor assembly FOL processes. Material is made of stainless steel, capable of offering high rigidity, corrosion and stain resistance. METAL REEL Metal reel is similar to spool reels which supports reel to reel lead frame strips transport, transfer and packaging. These are mainly used in semiconductor assembly EOL operations for reel-to-reel packages. Ribs can be added to enhance the rigidity of the reel. Dimensions can be customised according to lead frame strip specification to cater for varying chip packages. FINISHING :
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Aluminium Tube

Tube and tray are single piece extrusions, extruded and cut into length as per required IC chip package specifications. We offer a variety of end stopper designs ranging from rivet, silicone plug, teflon and embossed type. TUBE APPLICATION : IC chip handling and tube transfer in the following semiconductor processes :BakeBurn-inMarkingHandler TestTrim & FormTRAY APPLICATION : IC chip handling and tray transfer in the following semiconductor processes :BakeBurn-inHandler TestFINISHING :Anodise, refer to colour chartAnodise, refer to colour chartEOL CASSETTE ( STACK MAGAZINE ) EOL cassette comes in both stainless steel and aluminium material. These are mainlyused in semiconductor assembly EOL operations for lead frame strip handing. Perforation holes can be added to compensate the weight of the cassette. Dimensions can be customised according to lead frame or strip specification. APPLICATION : IC chip handling and tray transfer in the following semiconductor processes :MoldingMarkingTrim & FormPlatingBakingFINISHING :Stainless steelNatural Anodise
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ALUMINIUM MOULD BASE

Aluminium mould base is used in the LED frame production. FINISHING :Natural AnodiseOther finishing available upon request
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STAINLESS STEEL END COVER

End covers are used together with lead frame magazine as a safety measure to prevent lead frame from sliding out of the magazine during application and or handling processes. End covers are designed to fit the magazine dimensions, designs can be tailored to your specific needs. Material can be of aluminium or stainless stell.
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BOAT MAGAZINE

We assist in designing boat magazines and stainless steel boat carrier for your required packages and operating requirements. We offer services as such : Open toolings for standard package sizesDesign customisation for specific operating requirementEngraving and barcoding servicesAPPLICATION : Boat handling media for semiconductor assembly FOL processesDie AttachBakingTestingWire BondTrimmingFINISHING :Anodise ElectrolyticHard AnodiseElectroless Nickel Plating ( ENP )Other finishing available upon request, refer to colour chart WAFER CASSETTE FRAME CARRIER Wafer cassettes or wafer frame carriers are available indifferent wafer ring sizes, levels and pitching. Custom design available for various types of handles, protective( anti-static or non-antistatic ) top cover, finger grip. APPLICATION :Wafer handling media for semiconductorassembly FOL processesWafer Back GrindingWafer Die SortingWafer Die ShippingWafer DicingWafer Die Pick & PlaceFINISHING :Anodise, refer to colour chartHard Anodise
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Wire Spool

Spool is a single piece aluminium extrusion aided with precision machining according to customer specification. APPLICATION : Wire bonding process for gold, silver and copper wires FINISHING :AnodiseENPOther finishing available upon request
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  • S.S.Jayarane (TT TT Engineeing & Manufacturing Sdn Bhd)
  • No 1, Jalan 6/1, Lot 3472.Kawasan Seri Kembangan, Selangor - 43300, Malaysia
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