2 Binding Systems in Malaysia

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  • Automated Wire Bonding Inspection System

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    • Speed : 1.0sec

    Epoch Making 3D Visual inspection Only one second of measurement time, easy operations and flexible inspections. High Accuracy Measurement Height:1μm, 3σ Measurement Ability Speed:1.0sec Max measurement angle:±55° 3D2D Data Acquisition Data generated at once scanning more...

    Iwatani Corporation (Malaysia) Sdn Bhd

    Level 61 Menara Two Petronas Klcc Kuala Lumpur, Klp ,


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