Jaavin Electronic Solution Sdn. Bhd. Kuala Lumpur

We provide pcb design services. Electronics circuit design draw electrical schematic drawing pcb layout design pcb manufacturing/fabrication pcb assembly manual and smt electronic components sourcing embedded software/firmware development product development & manufacturing

We provide electronic circuit design services for all sort of simple to complex application. We are experienced in analog and digital design, embedded design, power supply, battery management, graphic display interface, wireless sensors, rf tranceivers and industrial design involving ethernet, usb, rs-485, rs-232 connectivity.

We cater to small volume printed circuit board, PCB fabrication (less than 10) to high volume PCB manufacturing quantity. Fabrication of PCB include single layer, double layer PCB to multi layer PCB, variety of material and finishing. PCB specifications currently supported: Number of layers: 2 to 12 Plated finishing: OSP, HAL-RoHs, Flash Gold(Max. 1.5µm), Immersion Gold(Max. 0.5µm), Gold finger PCB Material: FR4, BT-Resin, CEM1, roger, Aluminum Copper thickness: 0.5oz to 5oz Board thickness: 0.2mm to 4.8mm Board thickness tolerance: +-10% Minimum tracespace: 4mil4mil Soldering profile: 245℃ 5s Hot air profile: 288℃ 10s Impedance control: 10% Lead time (Prototype): 5~10 days depending on PCB layer count Lead Time (Volume order): 5~15 days depending on PCB layer count

Our value added services for complete solutions for manufacturing are production planning, technical support during pre-production, production and post production. Jaavin electronic solution also gives consultation on pcba testing in production line our contract manufacturing assembly lines are equipped with full auto smt lines, semi auto smt lines, automatic insert machines and aoi (automated optical inspection). We can support various types of components: 0.3 mm~32mm pitch csp, bga, qfp large qfps large connectors rf air coils manufacturing capability smt capacity: 300 million pointsmonth smt ic minimum package: qfp-0.4mm, csp-0.3mm, fpbga-0.3mm smt chip minimum size: 01005(0.016 × 0.0079 in) 0402 metric (0.4 × 0.2 mm) connector pitch minimum size: 0.3mm manufacturing facility screen printer smt mounter reflow oven auto-insertion