The Nano Indenter G300 utilizes a stage that supports samples with diameters up to 300 mm capable of providing a fast, reliable method for acquiring mechanical data on uncut silicon wafers. It permits testing of multiple layers, facilitating product development and failure analysis which can have a significant effect on yield, performance and longevity to devices Accurate, repeatable results compliant with ISO 14 Large sample stage supports test specimens with di Full testing automation enables nanoindentation in Electromagnetic actuation allows unparalleled dyna Flexible, upgradeable instrument can be configured Dynamic proper ties characterization via continuou Outstanding software with real-time experimental c