Exis Tech Sdn Bhd selangor

• SeriesEXIS COB (Chip on Board)
• SPECIFICATIONSUPH: >3,000 Input: Bowl Feeder or Tube Output: Tape and Reel (Hot and Cold seal) Reject: Binning or Tube Controller: IPC with Window XP OS

Model EXIS COB (Chip on Board) Machine Type Chip on board (accuracy +- 30um) Application Packages Assembly for RFID, Medical product, Consumer product Specification UPH: >3, 000 Input: Bowl Feeder or Tube Output: Tape and Reel (Hot and Cold seal) Reject: Binning or Tube Controller: IPC with Window XP OS Option Laser can be integrated with CO2, Fiber Laser Vision can be integrated with Orientation, Mark, Lead 2D, 3D, and 5S

• SeriesEXIS 200 (16 Position)
• SpecificationUPH:45,000 (with test time 40ms) Input: Bowl Feeder or Tube Output: Tape and Reel (Hot and Cold seal) Test site: Up to 4 Reject: Binning or Tube Controller: IPC with Window XP OS

Model EXIS 200 Machine Type 16 Position Turret System (accuracy +- 10um) Application Packages SOT023, SOT323, SOT346, SOT353, SOT363, SOT457, SOT223, SOT523, SOD123, SOD323, SOD523, SOD723, TSOP, TSSOP, SOIC, MSOP, QFN, SMA, B and C, Resistor , Dpak, D2pak and Glass Diodes Specification UPH:45, 000 (with test time 40ms) Input: Bowl Feeder or Tube Output: Tape and Reel (Hot and Cold seal) Test site: Up to 4 Reject: Binning or Tube Controller: IPC with Window XP OS Option Laser can be integrated with CO2, Fiber Laser Vision can be integrated with Orientation, Mark, Lead 2D, 3D, 5S and In-Pocket Inspection

• modelWTS-L10 Series (Wafer to Tape Sorter)
• Reel DimensionInput : 22″ Output : 7″ & 13″ Cover Tape: 220mm (OD)

Model WTS-L10 Series Machine Type Wafer to Tape Sorter (Linear System) Throughout (by die size) 0.3mm – 2mm = 10, 000 UPH 2mm – 6mm = 9, 000 UPH 6mm – 12.5mm = 8, 000 UPH Placement Accuracy +- 25um at 3 sigma +- 1 degree theta Die Size 0.3mm to 12.5mm Wafer Input Automated wafer loading 25 slots, for wafer up to Ø 300mm Vision Inspection Wafer Inspection andDie During Placement Inspection (DDP) : Bump size, shape, array : Edge chip : Ink dot : Place position X, Y, Ø Pre-Place & Post-Place Inspection : Edge chip : Laser mark : Pin 1 : Position in-pocket Tilted Die Inspection : Die flat in pocket After Seal Inspection : Die flat in pocket : Cover tape position Tape Width 8mm to 24mm Reel Dimension Input : 22″ Output : 7″ & 13″ Cover Tape: 220mm (OD) Network Ethernet or SECS TCPIP Footprint 1980mm x 1720mm x 2150mm Facilities Air : 6 to 7 bars Power: 220-240VAC, 1 PHASE 1.0KVA, 50-60Hz Optional Flip or Non-Flip Die JEDEC Tray Indexer Waffle Pack Indexer

• SeriesEXIS PP_BT (Pick and Place)
• SpecificationUPH:3,000 to 5,000 Input: Bowl Feeder or Tube or Tray Output: Tube or Tray or Tape and Reel Test site: Up to 2 Reject: Binning or Tube

Model EXIS PP_BT (Pick and Place) Machine Type Pick and Place (accuracy +- 25um) Application Packages SOT023, SOT323, SOT346, SOT353, SOT363, SOT457, SOT223, SOT523, SOD123, SOD323, SOD523, SOD723, TSOP, TSSOP, SOIC, MSOP, QFN, SMA, B and C, Resistor and Glass Diodes Specification UPH:3, 000 to 5, 000 Input: Bowl Feeder or Tube or Tray Output: Tube or Tray or Tape and Reel Test site: Up to 2 Reject: Binning or Tube Controller: IPC with Window XP OS Option Laser can be integrated with CO2, Fiber Laser Vision can be integrated with Orientation, Mark, Lead 2D, 3D, 5S and In-Pocket Inspection